UHD / NAFI





 

Medium to high-density interconnects with fork and blade contacts - module card connectors withy flex termination and solderless press-fit backplane connectorsfor attachment to PCBs. EMI shielding, coax, fiber optic, board to board, staggered grid pattern, and power contacts available. Standards : Mil-C-28754, EIA 15-763, and DESC89065.

MARKETS:
- Military & Commercial Aviation
- Space Applications
- Shipboard Applications
- Military Vehicles
- C4I Electronics
- Ordnance

Relative Standards
MIL-DTL-28754 & DSCC 89065
   
© AMPHENOL 2007