NeXLev



 Download datasheet [681,31 Ko]

 

NeXLev
Amphenol's NeXLev® high-density parallel board connector is capable of handling data rates up to 12.5 Gbps, providing a robust solution for your increasing bandwidth demands in mezzanine applications. The connector can be routed to support single-ended or differential archiectures and offers 20 stacking heights from 10-33mm. NeXLev uniquely applies BGA attachment technology, widely accepted for its high reliability, making it robust both during manufacturing and in the field.

- Enhanced BGA attachment process to increase SMT yields
- 125 micron coplanarity
- 57 real signals per linear centimeter (145 signals per inch)
- 20 stacking heights from 10-33mm
   
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