HDM



 Download datasheet [681,31 Ko]

 

Amphenol’s HDM/HDMPLUS connector family follows the modular format adopted by Amphenol to provide a high degree of design freedom and scalability for board-to-backplane interconnect systems. Daughterboard connector assemblies are constructed using individual modules assembled onto a stainless steel stiffener. Both shielded and unshielded modules can reside on the same stiffener providing design flexibility.

HDM’s 6-row, 2.0mm grid spacing provides density of 75 contacts per inch (30 contacts per linear centimeter). Electrically, HDM can operate in applications with rise times as low as 500 pico seconds. With over 100 million mated signal lines installed, HDM is the proven choice for demanding applications in telecom and datacom.
   
© AMPHENOL 2007